BGA設(shè)備&能力  BGA Equipment & Capability 

1、BGA工藝制程控制: BGA烘烤、錫膏回溫、網(wǎng)板印刷、爐溫

Process control of BGA assembly: Bulk BGA baking, warming-up solder paste, stencil printing, oven temperature.

2、BGA 最小間距：0.3MM

Minimum space between components：0.3MM

SMT 設(shè)備能力  SMT Capability

1、生產(chǎn)線貼裝產(chǎn)能：9500萬點/月

SMT line productivity: 95 million points per month

2、大PCB板尺寸：L = 510MM, W = 460MM

Maximum size of PCB: L = 510MM, W = 460MM

3、最小PCB板尺寸：L = 50MM, W = 30MM

Minimum size of PCB: L = 50MM, W = 30MM

4、貼片PCB板厚度：0.4MM - 4MM (1-12層)

Thickness of PCB: 0.4MM - 4MM (1-12 layers)

5、貼片最小尺寸：0201 (0.6*0.3MM）

Minimum component size for SMT: 0201 (0.6*0.3MM）

6、貼片大異型：33.5*33.5MM

Maximum component size for SMT: 33.5*33.5MM

7、芯片最小間距：0.2MM

Minimum space between components：0.2MM